Products
Suppliers
Sign in
Register
Shenzhen Hiner Technology Co.,LTD
Manufacturer from China
Verified Supplier
5 Years
Home
Products Catalog
Company Profile
Quality Control
Contact Us
Request a Quota
English
Français
Русский язык
Español
日本語
Português
JEDEC IC Trays (54)
JEDEC Matrix Trays (52)
IC Chip Tray (43)
Custom JEDEC Trays (52)
Waffle Pack Chip Trays (51)
Electronic Components Tray (20)
Bare Die Trays (36)
Anti Static Trays (22)
Waffle Pack Lids Clips (24)
Gel Sticky Box (16)
Wafer Shipping Box (27)
Metal Wafer Cassette (12)
Home
/
Products
/
JEDEC Matrix Trays
/
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
/
show pictures
Product Categories
JEDEC IC Trays
[54]
JEDEC Matrix Trays
[52]
IC Chip Tray
[43]
Custom JEDEC Trays
[52]
Waffle Pack Chip Trays
[51]
Electronic Components Tray
[20]
Bare Die Trays
[36]
Anti Static Trays
[22]
Waffle Pack Lids Clips
[24]
Gel Sticky Box
[16]
Wafer Shipping Box
[27]
Metal Wafer Cassette
[12]
Contact Now
Shenzhen Hiner Technology Co.,LTD
Visit Website
City:
shenzhen
Province/State:
guangdong
Country/Region:
china
Contact Person:
MsRainbow Zhu
View Contact Details
Contact Now
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Products Detailed
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Secure, stackable, and fully traceable, our JEDEC trays streamline logistics in fast...
View Products Detailed →
Product Tags:
opmg200 pcb
ceneo laminat fr4 pcb
ltbrct351f lcd module
