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Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD The Pioneer Of R&D and Application In Semiconductor Carrier Products

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5 Years
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Home / Products / Jedec Matrix Trays / Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices /

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Jedec IC Trays

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Jedec Matrix Trays

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IC Chip Tray

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Custom Jedec Trays

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Waffle Pack Chip Trays

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Electronic Components Tray

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Bare Die Trays

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Anti Static Trays

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Wafer Shipping Box

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Gel Sticky Box

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Waffle Pack Lids Clips

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Metal Wafer Cassette

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Shenzhen Hiner Technology Co.,LTD
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsRainbow Zhu
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Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
  • Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
  • Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
  • Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices
Products Detailed
Waterproof Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Waterproof Black MPPO Standard Jedec Trays Can Be Designed For BGA IC Devices ...
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