Shenzhen Hiner Technology Co.,LTD
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Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.
Electronic component; Semiconductor; Embedded System; Display technology; Micro and Nano systems; Sensor; Test and Measurement Technology; Electromechanical equipment and systems; Power supply
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN1890 | Cavity Size | 6*8*1mm |
| Package Type | BGA IC | Matrix QTY | 24*16=384PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Reference to the temperature resistance of different materials:
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized | ||
Q1: Are you a manufacturer?
Ans: Yes, we have an ISO 9000 Quality Management System.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
Ans: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will inspect according to the ISO 9000 standard and be ruled by our QC staff.