Products Suppliers Sign in Register

Shenzhen Hiner Technology Co., Ltd.

Manufacturer from China
Verified Supplier
5 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quote
English
Home / Products / JEDEC Matrix Trays / JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging /

show pictures

Product Categories

JEDEC IC Trays

 [58]

JEDEC Matrix Trays

 [65]

IC Chip Tray

 [53]

Custom JEDEC Trays

 [63]

Waffle Pack Chip Trays

 [51]

Electronic Components Tray

 [26]

Bare Die Trays

 [42]

Anti Static Trays

 [22]

Waffle Pack Lids Clips

 [26]

Gel Sticky Box

 [16]

Wafer Shipping Box

 [28]

Metal Wafer Cassette

 [12]
Contact Now
Shenzhen Hiner Technology Co., Ltd.
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsRainbow Zhu
View Contact Details
Contact Now

JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
  • JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
  • JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
  • JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
  • JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
  • JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging
Products Detailed
JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging Engineered for precision and reliability, this JEDEC matrix tray delivers ...
View Products Detailed →

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4