Shenzhen Hiner Technology Co.,LTD
Shenzhen Hiner Technology Co.,LTD The Pioneer Of R&D and Application In Semiconductor Carrier Products
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• JEDEC matrix trays come in standard outline dimensions of 12.7 x 5.35 inches (322.6 x 136mm). These trays are designed to accommodate a wide range of standard components, including BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC. Low profile trays with a thickness of 0.25-inch (6.35mm) are suitable for 90% of standard components, while a high profile version of 0.40-inch (10.16mm) is available for thicker components like PLCC, CERQUAD, and PGA.
• The design of JEDEC trays is carefully thought out to facilitate handling and orientation of components. The central area of the trays features flat cells, enabling automated handling using vacuum pick up tools. A scalloped feature on one side allows for the use of a pin to mechanically fix the correct orientation of components, while a 45-degree chamfer in one corner serves as a visual indicator of Pin 1 orientation.
• Stackability is a key feature of JEDEC trays, allowing them to be stacked within the same device family and maker's model. It is important to note that mixing trays from different manufacturers is not recommended, even within the same device family, due to slight variations between brands. While JEDEC trays can be stacked to several feet high, the standard practice limits stacking to 5 to 7 trays.
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN24017 | Cavity Size | 6.4*37*3mm |
| Package Type | IC Component | Matrix QTY | 6*11=66PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
• When JEDEC developed its matrix tray standard outline, all focus was placed on the external size and features. The interior was intentionally left undefined and unrestricted. This left the door open for the matrix tray outline to be used for an unlimited variety of products and components.
• The first JEDEC Trays were designed for the semiconductor industry. These trays are often referred to as IC matrix trays. This continues to be the most common use with trays used for through-hole devices like PGA, DIP, and TO packages; surface mount devices like, QFP, BGA, TSOP, and FP packages; and leadless devices like LGA, QFN, and LCC packages.
Q: How can I get a quotation?
A: Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.
Q: How long will it take to get a response?
A:We will reply to you within 24 hours of working day.
Q: What kind of service we provide?
A:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
Q: What is your terms of delivery?
A:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
Q: How to guarantee quality?
A:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.