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Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD The Pioneer Of R&D and Application In Semiconductor Carrier Products

Manufacturer from China
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5 Years
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Home / Products / Jedec IC Trays / Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray /

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Jedec IC Trays

 [44]

Jedec Matrix Trays

 [52]

IC Chip Tray

 [43]

Custom Jedec Trays

 [52]

Waffle Pack Chip Trays

 [51]

Electronic Components Tray

 [20]

Bare Die Trays

 [16]

Anti Static Trays

 [22]

Wafer Shipping Box

 [26]

Gel Sticky Box

 [14]

Waffle Pack Lids Clips

 [24]

Metal Wafer Cassette

 [11]
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Shenzhen Hiner Technology Co.,LTD
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsRainbow Zhu
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Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
  • Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
  • Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
  • Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
  • Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray
Products Detailed
ESD Black Chip Die BGA QFN Packaging Tray For Optoelectronic Devices Tray Antistatic electronic JEDEC trays are special plastic packaging materials ...
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