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Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray

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Shenzhen Hiner Technology Co.,LTD
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Province/State:guangdong
Country/Region:china
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Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray

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Brand Name :Hiner-pack
Model Number :HN23054
Place of Origin :China
Certification :ISO 9001 SGS ROHS
MOQ :1000 pcs
Price :TBC
Packaging Details :80~100pcs/carton(According to the customer demand)
Delivery Time :1~2 Weeks
Payment Terms :100% Prepayment
Supply Ability :2000PCS/Day
Anti-Static :OEM ESD ESD Tray /ESD Container PCB
Heat Resistant :High Temperature 270°
Injection Mold :Lead Time 20~25Days
Durable :Yes
Hardness :Hard
Height :7.62mm
Reusable :Yes
Clean Class :General And Ultrasonic Cleaning
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Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray

Each JEDEC tray we deliver can be custom-fitted to your IC's footprint—ensuring secure, ESD-safe transport.


Designed for high-reliability electronics manufacturing environments, this JEDEC matrix tray combines precise component positioning with exceptional durability and static protection. Its uniform pocket structure ensures consistent alignment of parts throughout pick-and-place, inspection, and packaging processes. With key alignment indicators and compatibility across a range of automated equipment, this tray is a practical solution for minimizing handling errors and maximizing workflow efficiency. Whether in high-volume production or custom assembly lines, it ensures components remain secure and undamaged.

Features & Benefits:

• Industry Standard Format: Built to JEDEC matrix specifications, ensuring compatibility with universal tray handling and test systems.

• High-Performance ESD Protection: Composed of materials with stable conductive properties, ensuring protection from electrostatic discharge.

• Consistent Pocket Integrity: Each pocket is dimensionally stable, providing a secure fit that minimizes shifting during transport or processing.

• Automation-Optimized Structure: Integrated features such as vacuum pickup zones and mechanical orientation guides enable seamless robotic handling.

• Strong Stackability: Interlocking tray edges maintain alignment during stacking, reducing the chance of tray slippage or misfeeds.

• Operational Stability: Maintains structural integrity under typical processing environments, including temperature variation and high-cycle usage.

Technical Parameters:

Usage Packaging of Electronic Components, Optical device
Feature ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material MPPO, PPE, ABS, PEI, IDP, etc.
Color Black, Red, Yellow, Green, White, and custom color
Size Customized size, rectangle, circle shape
Mold type Injection Mold
Design Original sample, or we can create the designs
Packing By Carton
Sample Sample time: after the draft is confirmed and payment is arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time 5-7 Working days
The exact time should be according to the ordered quantity

Applications:

This tray is widely used in semiconductor fabrication, SMT lines, testing facilities, and module assembly operations. It facilitates error-free positioning and handling of a wide array of components, including ICs, surface mount devices, and hybrid modules. Its robust design supports both manual and automated workflows, ensuring part security during inspection, burn-in testing, or final packaging.

Customization:

To support a broad range of unique part requirements and handling workflows, the tray can be customized in multiple ways:

• Custom Pocket Design: Pocket size and arrangement can be adjusted to accommodate non-standard component shapes or fragile structures.

• Color Customization: ESD-safe tray materials can be produced in various colors for easy part family or line identification.

• Integrated Identification Features: Permanent tray ID markers can be molded during production for traceability and inventory control.

• Modified Edge Profiles: Tray edges and alignment features can be tailored to improve compatibility with specific feeders or automation tools.

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