Shenzhen Hiner Technology Co.,LTD
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Precision 2 Inch PC Waffle Pack Chip Tray for Electronic Parts
The waffle pack is manufactured using existing tooling, completely eliminating initial costs such as tooling design and manufacturing costs. Once the customer tell us the size of the tray or the product drawing, and then we can judge whether the product is suitable for this tray.Meanwhile, our standard waffle pack supports high mixing and small batch products.
Hiner-pack offer standard trays in a variety of shapes and sizes, such as trays with square, rectangular and round pockets, as well as trays with a variety of pockets. We can precisely control the flatness of the product in the design stage of the product and the mold by using methods such as mold flow simulation. Hiner-pack standard waffle pack supports high mixing and small batch products.
The Detail of HN22019 Waffle Pack
The main material of HN22019 tray is PC, which is a common industrial raw material. It is mainly used for small-scale production and storage of small series of components. At the same time, according to customers' different needs for products, we can also provide the corresponding plastic material selection. Each type of material has different advantages and disadvantages, we can guide you to choose the right material.
This waffle tray is small and lightweight. According to the specific pocket size, we design the most reasonable 20*20 matrix design.In this way, it can accommodate customers' products to the maximum extent, thus reducing customers' storage costs. The waffle pack contains a matrix pocket where each pocket contains a component or assembly. Once installed, each product is covered with anti-static paper and a lid is used to hold the waffle packes together.
| Outline Line Size | 50.8*50.8*4mm | Brand | Hiner-pack |
| Model | HN22019 | Package Type | Die |
| Cavity Size | 1.0*1.1*0.45 | Matrix QTY | 20*20=400PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
The Application of HN22019 Waffle Pack Chip Tray
Electronic Component Factory SMT Surfacing Factory
Optical Industry Military Industry
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantage
1. Have exported for more than 10 years.
2. Have professional engineer and efficient management.
3. Delivery time is short, normally in stock.
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Factory have ISO certificate, Product comply to ROHS standard.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3. Can I order if quantity less than MOQ?
Ans:Yes and it would be taken as sample order to production. We take more serious on sample order.
Q4. Can I get Free Samples?
Ans:Yes, If samples we have in stock would be provided for testing, but shipment should at your side.If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.
Q5: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product.