Shenzhen Hiner Technology Co.,LTD
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Waffle Pack Chip Tray Series For LED Chips Packaging Solution
To protect IC or conponents during shipments, It is critically important to choose the right supply form and packaging.Movement of the product within the container, contact with upper surfaces, electrostatic discharge (ESD), or exposure to air can damage the product.
Hiner-pack offers a wide selections of products to meet your specific bare die, chip scale, package shipping and handling needs. As packaging experts, we can help you choose the waffle pack that best meets your manufacturing needs while protecting your bare die from corrosion and ESD.
Details Of HN21131 Chip Tray
The HN21131 waffle pack is mainly made of PC. The material has good stability and can protect customers' electronic products well. The matrix design of 18*15-16 can also load more customers' products. In addition, multiple trays can overlap, increasing the storage of products and saving shipping costs.
| Outline Line Size | 50*50*4.5mm | Brand | Hiner-pack |
| Model | HN21131 | Package Type | Die |
| Cavity Size | 1.4*1.8*0.9 | Matrix QTY | 18*15-16=254PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN21131 Chip Tray
Electronic Components Semiconductor
Embedded System Micro and Anon System
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3. Can I order if quantity less than MOQ?
Ans:Yes and it would be taken as sample order to production. We take more serious on sample order.
Q4. Can I get Free Samples?
Ans:Yes, If samples we have in stock would be provided for testing, but shipment should at your side.If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required.
Q5: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.
Q6. Do you arrange shipment for the products?
Ans:It’s depends on our incoterms.If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
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