Shenzhen Hiner Technology Co.,LTD
Shenzhen Hiner Technology Co.,LTD The Pioneer Of R&D and Application In Semiconductor Carrier Products
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Customized High Temperature PC Chip Tray for loading IC Chip
The Chip tray is a carrier for semiconductor chip enterprises to package and bake their chips, mainly used for QFA, BGA, TSOP, PGA and other semiconductor packaging inspection, storage and transportation. Compared with other traditional packaging methods, it can not only hold the small parts, but also provide high temperature resistance, anti-static and other function.
From design drawing, mold manufacturing, production to clean packaging. All steps and operations are strict quality controlled. We take customer satisfaction as the ultimate goal. Constantly meet customer requirements to promote our factory to a higher level of progress.
Details of the HN21111 Chip Tray
HN21111 Waffle Pack is used to provide clean, secure packaging for bare die and other electronic chips. It also has many functions such as bending resistance, bearing strength and high temperature resistance. Customers choose chip trays based on pocket size, which is to avoid the device spinning or flipping in the pocket.
We can customize various specifications and sizes according to customer requirements to achieve the most reasonable loading. In addition, there are matching cover, clip, Tyvek paper for customers to choose. Multiple waffle packs can be stacked on top of each other, increasing storage of electronic components and thus saving production cost.
| Outline Line Size | 50.75*50.75*3.96mm | Brand | Hiner-pack |
| Model | HN21111 | Package Type | Die |
| Cavity Size | 4.6*4.6*1.0 | Matrix QTY | 7*7=49PCS |
| Material | PC | HS Code | 3923900000 |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of HN21111 Waffle Pack
Semiconductor Display Technology
Micro and Nano Systems Test and Measurement Technology
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Our Service
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize.