Shenzhen Hiner Technology Co.,LTD

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ESD Waffle Pack Electronic Components Tray

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Shenzhen Hiner Technology Co.,LTD
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsRainbow Zhu
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ESD Waffle Pack Electronic Components Tray

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Brand Name :Hiner-pack
Model Number :To meet all kinds of custom needs of customers
Certification :ISO 9001 ROHS SGS
Place of Origin :Made In China
MOQ :1000 pcs
Price :0.25~0.55usd/pcs
Payment Terms :T/T
Supply Ability :The capacity is between 4000PCS~5000PCS/per day
Delivery Time :5~8 working days
Packaging Details :It depends on the QTY of order and size of product
Material :ABS.PC.PPE.MPPO...etc
Color :Black.Red.Yellow.Green.White..etc
Property :ESD,Non-ESD
Design :Standard and Non-standard
Size :All kinds of
Surface Resistance :1.0x10E4~1.0x10E11Ω
Clean class :General And Ultrasonic Cleaning
Incoterms :EXW,FOB,CIF,DDU,DDP
Injection Mold :Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method :Injection Moulding
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ESD Waffle Pack Electronic Components Tray
Durable Antistatic ABS Non-Standard Waffle Pack With Different Size Can Be Customized For Optoelectronic Components

As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.

Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).


Advanges

1. More than 10 years export experience
2. With professional engineers and efficient management
3. Short delivery time and good quality
4. Support small batch production in the first batch
5. Professional sales within 24 hours efficient reply
6. Factory has ISO certification, and the products comply to RoHS standard.
7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service or cost performance has been well recognized

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products


Product Application

Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging

Packaging
Packaging Details:Packing according to customer's specified size
ESD Waffle Pack Electronic Components Tray
FAQ

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

ESD Waffle Pack Electronic Components Tray

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