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Shenzhen Hiner Technology Co.,LTD

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City:shenzhen

Province/State:guangdong

Country/Region:china

Contact Person:MsRainbow Zhu

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China DRAM IC ESD Component Tray For Electronics Parts Packing wholesale

DRAM IC ESD Component Tray For Electronics Parts Packing

Name: DRAM IC ESD Component Tray For Electronics Parts Packing
Brand: Hiner-pack
Price: 1.35 USD

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Brand Name :Hiner-pack

Model Number :HN1876 Yellow

Certification :ISO 9001 ROHS SGS

Place of Origin :Made In China

MOQ :1000 pcs

Price :$1.35~$2.38(Prices are determined according to different incoterms and quantities）

Payment Terms :T/T

Supply Ability :The capacity is between 2500PCS~3000PCS/per day

Delivery Time :5~8 working days

Packaging Details :80~100pcs/per carton

Material :PC

Color :Yellow

Temperature :100°C

Property :ESD

Surface resistance :1.0x10E4~1.0x10E11Ω

Flatness :less than 0.76mm

Clean Class :General and ultrasonic cleaning

Incoterms :EXW,FOB,CIF,DDU,DDP

Customized service :Support standard and non-standard,precision machining

Injection mold :Customized case need(Lead time 25~30Days,Mold Life Span: 300,000 times.)

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DRAM IC ESD Component Tray For Electronics Parts Packing

ESD PC IC Trays With Different Cavities Can Be Customized For DRAM IC

Quick Detail

1. Designs conforms JEDEC international standard, and has strong versatility.

2. Optimal product design,can provide a variety of packaging IC with protection and while reducing transportation costs.

3. V type tray designs, with added protection for IC substrate edge ball placement.

4. A variety of materials for customers to choose from to meet your ESD and process requirements.

5. Support for non- standard format customization.

6. BGA,QFN,QFP,PGA,TQFP,LQFP, SoC SiP etc. All packaging methods are available. Can be customized based on customers requirement(e.g: ESD property, Baking Temp,Baking Time).

7.The design of the structure and shape in line with Jedec international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.

Jedec Tray
Outline Line Size	322.6135.97.62mm	Brand	Hiner-pack
Model	HN1876	Package Type	IC
Cavity Size	2.9X4.1X2.7mm	Size	Customized
Material	PC	Flatness	MAX 0.76mm
Resistance	1.0x10e4-1.0x10e11Ω	Service	Accept OEM,ODM
Color	Yellow	Certificate	ROHS

DRAM IC ESD Component Tray For Electronics Parts Packing

Product Application

Package IC PCBA module component

Electronic component packaging Optical device packaging

Packaging

Packaging Details:Packing according to customer's specified size

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature and other special requirements can be customized

FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

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