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Optoelectronic Component Waffle IC Tray 2 Inch Antistatic ISO Certificate

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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsRainbow Zhu
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Optoelectronic Component Waffle IC Tray 2 Inch Antistatic ISO Certificate

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Brand Name :Hiner-pack
Model Number :HN 65*65*40
Certification :ISO 9001 ROHS SGS
Place of Origin :Made In China
MOQ :1000 pcs
Price :$0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms :T/T
Supply Ability :The capacity is between 4000PCS~5000PCS/per day
Delivery Time :5~8 working days
Packaging Details :It depends on the QTY of order and size of product
Material :ABS
Color :Gray
Property :ESD
Design :Standard
Size :2 Inch
Surface Resistance :1.0x10E4~1.0x10E11Ω
Clean class :General And Ultrasonic Cleaning
Incoterms :EXW,FOB,CIF,DDU,DDP
Injection Mold :Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method :Injection Moulding
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Optoelectronic Component Waffle IC Tray 2 Inch Antistatic ISO Certificate

Durable Antistatic ABS Waffle Pack Can Be Customized For Optoelectronic Components

Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.

Anti - static tray is an ideal tool for storing electronic components. Due to the addition of special polymer chains in the raw material, the finished product has permanent electrostatic dissipation properties. The finished product has good mechanical strength and heat resistance; Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time and temperature.

Anti-static tray can effectively release the static charge accumulated on the surface of the object, so that it will not produce charge accumulation and high potential difference; It can greatly reduce the damage rate of electronic products in the production process, reduce the cost, and improve the product quality and profit.

Detail Information

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products
Outline Line Size 50*50*4mm Brand Hiner-pack
Model HN 65*65*40 Package Type IC Parts
Cavity Size 1.65*1.65*1.02mm Matrix QTY 20*20=400PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS

Product Application

Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging


Packaging


Packaging Details:Packing according to customer's specified size

Optoelectronic Component Waffle IC Tray 2 Inch Antistatic ISO Certificate

FAQ

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Optoelectronic Component Waffle IC Tray 2 Inch Antistatic ISO Certificate

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